The name is the button.

An agent writes the code now, and a human thumb hovers over Accept all a hundred times a day. The honest question of this decade is what, exactly, you just accepted. So I read the diff.

Eight years as a backend engineer in Stockholm, back in Tokyo since 2023, and I still ship something small most nights, usually badly. My one rule: the only real review of a model is the thing you built with it. That is why there is no leaderboard on this site.

Around two hundred sources come through — the labs' own posts, the papers, the tools, the runtimes and languages nobody is watching yet, the chip under the demo, and the newsletters people actually forward. What is moving gets counted so the week reads at a glance, and every few days I explain one mechanism in plain words.

A story here is a headline, a short excerpt, one image and the link to whoever wrote it. We never reproduce the post; the images belong to their authors. A post written in Japanese appears in Japanese, exactly as it was published, and the link goes to the original.

— Yuki Halvorsen, Tokyo

← Accept All Archive

Tech in AsiaAsia

DayOne secures $237m bank loan for Hong Kong data center

11.06

DayOne is also planning a US initial public offering but is considering a delay or a smaller deal.

Chips & compute Funding & deals

Read at Tech in Asia ↗

One letter a week, starting soon.

Latest

DayOne secures $237m bank loan for Hong Kong data center

Related

AsiaGoogle to back $19b Anthropic Kentucky data center lease Tech in Asia

AsiaOracle reportedly cancels $7 billion Tencent AI chip lease under US pressure TechNode

ValleyThe chips are down: Qualcomm falls on revenue miss, weak guidance; Arm and GlobalFoundries do little better SiliconANGLE

SiliconMarvell Cuts To The Front Of The Datacenter Optics Line With Lumentum Deal The Next Platform

AsiaVisual brain-computer interface developer Nanochap raises RMB 500 million TechNode

AsiaAI inference chipmaker Moffett AI raises nearly RMB 1 billion in Series C+ funding TechNode