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PandailyAsia

HiSilicon Backs NearLink SLE 3.0 Evolution Blue Paper at CEIC 2026 in Shenzhen

10.23

Shanghai HiSilicon used the Consumer Electronics Innovation Conference (CEIC) 2026 in Shenzhen, held October 22 to 24, to cast OpenHarmony, NearLink short-range links, on-device AI and…

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