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Huawei's Kirin 2026 Data Backs Tau Scaling Against Stack Heat Fears

September 7
Huawei's Kirin 2026 Data Backs Tau Scaling Against Stack Heat Fears

He Tingbo's latest paper cites Kirin 2026 silicon: ~55% higher transistor density with sharp NPU/GPU/CPU power cuts at matched performance—arguing LogicFolding can cool, not melt, stacked logic.

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