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Chip Industry Technical Paper Roundup: Oct. 20

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out…
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SiliconAgentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC) SemiEngineering

SiliconNvidia Vera’s System Architecture: Pushing Bandwidth Chips and Cheese

ToolsScaling Kimi K3 on AMD Instinct MI355X: Matching NVIDIA HGX B300 Throughput per GPU on AgentX vLLM Blog

SiliconArm at the OCP Global Summit 2026: How Arm AGI CPU is scaling agentic AI infrastructure from CPU to rack Arm Newsroom

SiliconNVIDIA Nemotron 3.5 Super VL Powers Specialized Agents with Multimodal Reasoning NVIDIA Technical Blog
